TY  - JOUR
AB  - Laminated substrates are used widely in the manufacture of multichip
modules (MCM‐L) by the electronic packaging industry. Of late, the thrust has
been towards higher density circuitry to achieve improved performance and reduced size. This has
led to the use of finer lines and spacings, smaller drilled holes and buried vias in organic laminatesleading to reliability issues such as electrochemical migration. One of the
forms of electrochemical migration is known as conductive filament formation. Conductive filament
formation is an electrochemical process. In accelerated environments of temperature and humidity,
organic laminates can develop a loss of insulation resistance between conductors, eventually resulting
in loss of electrical function of the circuit. The paper aims at discussing electrochemical migration in
general, and conductive filament formation in particular, and its impacton the reliability of
MCM‐L.
VL  - 22
IS  - 1
SN  - 0305-6120
DO  - 10.1108/03056129610799868
UR  - https://doi.org/10.1108/03056129610799868
AU  - Rudra B.
AU  - Li M.J.
AU  - Pecht M.
AU  - Jennings D.
PY  - 1996
Y1  - 1996/01/01
TI  - Electrochemical Migration in Multichip Modules
T2  - Circuit World
PB  - MCB UP Ltd
SP  - 67
EP  - 70
Y2  - 2024/04/25
ER  -