Electrochemical Migration in Multichip Modules

B. Rudra (Delco Electronics Corporation, Kokomo, Indiana, USA)
M.J. Li (CALCE Electronic Packaging Research Center, University of Maryland, College Park, Maryland, USA)
M. Pecht (CALCE Electronic Packaging Research Center, University of Maryland, College Park, Maryland, USA)
D. Jennings (Rockwell International Corporation, Cedar Rapids, Iowa, USA)

Circuit World

ISSN: 0305-6120

Publication date: 1 April 1996


Laminated substrates are used widely in the manufacture of multichip modules (MCM‐L) by the electronic packaging industry. Of late, the thrust has been towards higher density circuitry to achieve improved performance and reduced size. This has led to the use of finer lines and spacings, smaller drilled holes and buried vias in organic laminates leading to reliability issues such as electrochemical migration. One of the forms of electrochemical migration is known as conductive filament formation. Conductive filament formation is an electrochemical process. In accelerated environments of temperature and humidity, organic laminates can develop a loss of insulation resistance between conductors, eventually resulting in loss of electrical function of the circuit. The paper aims at discussing electrochemical migration in general, and conductive filament formation in particular, and its impact on the reliability of MCM‐L.



Rudra, B., Li, M., Pecht, M. and Jennings, D. (1996), "Electrochemical Migration in Multichip Modules", Circuit World, Vol. 22 No. 1, pp. 67-70. https://doi.org/10.1108/03056129610799868

Download as .RIS




Copyright © 1996, MCB UP Limited

Please note you might not have access to this content

You may be able to access this content by login via Shibboleth, Open Athens or with your Emerald account.
If you would like to contact us about accessing this content, click the button and fill out the form.
To rent this content from Deepdyve, please click the button.