Development of new laminates for high performance interconnection technology in avionics applications

Abstract

Purpose

The purpose of this paper is to detail various aspects of laminates and their current developments in order to enable the selection and development of appropriate laminate systems for use in high performance avionics interconnection applications.

Design/methodology/approach

Electronic packaging must provide circuit support, heat dissipation, signal distribution, manufacturability, serviceability, power distribution and data for performance simulation over the required frequency range in avionics applications. Innovations in packaging technology have made a big impact on the types of laminates that can be used in printed circuit boards destined for these applications. The “environments” in which aircraft are required to operate have changed due to global security threats and the laminates traditionally used are not designed for this role. Aircraft systems are expected to withstand disturbances due to unexpected threats. Various factors which determine the performance of laminates are evaluated.

Findings

The safety of aircraft is critically dependent on the interconnection technology in which laminates have a major role. Under global security threats, passenger safety, emergency landing and timely information to the pilot is of paramount importance. Hence, research programs need to be initiated to develop new innovative laminate systems, since traditional laminates have limitations in these applications.

Research limitations/implications

The availability of data on the performance of laminates used in interconnection technology under various security threats is limited.

Originality/value

The paper describes how new laminates for high performance interconnection technology in avionics applications can be developed.

Citation

Raghunath, C.R., Raghunath, U., Yeshaswini, H.S. and Rashmi, H. (2013), "Development of new laminates for high performance interconnection technology in avionics applications", Circuit World, Vol. 39 No. 1, pp. 22-30. https://doi.org/10.1108/03056121311298936