To read this content please select one of the options below:

Integrated MEMS in package

Mark Bachman (Department of Electrical Engineering and Computer Science, University of California, Irvine, California, USA)
G.P. Li (Department of Electrical Engineering and Computer Science, University of California, Irvine, California, USA)

Circuit World

ISSN: 0305-6120

Article publication date: 16 November 2012

428

Abstract

Purpose

The purpose of this paper is to present the utilities of packaging and PCB fabrication processes for manufacturing micro electromechanical systems (MEMS) and its package for sensing and actuation applications.

Design/methodology/approach

A broad array of manufacturing approaches available in the packaging industry, including lamination, lithography, etching, electroforming, machining, bonding, etc. and a large number of available functional materials such as polymers, ceramics, metals, etc. were explored for producing functional microdevices with greater design freedom.

Findings

Good quality MEMS devices can be manufactured using packaging style fabrication, particularly using stacks of laminates. Furthermore, such microdevices can be built with a high degree of integration, pre‐packaged, and at low cost.

Research limitations/implications

Further manufacturing research work should be undertaken in collaboration with the PCB and packaging industries, which stand to benefit greatly by expanding their offerings beyond serving the semiconductor industry and developing their own integrated MEMS products.

Originality/value

The paper presents examples of basic packaging fabrication processes for producing 3‐D structures and free‐standing structures, and a new MEMS manufacturing paradigm to build micro‐electromechanical (MEMS) for biomedical, optical, and RF communication applications.

Keywords

Citation

Bachman, M. and Li, G.P. (2012), "Integrated MEMS in package", Circuit World, Vol. 38 No. 4, pp. 184-192. https://doi.org/10.1108/03056121211280404

Publisher

:

Emerald Group Publishing Limited

Copyright © 2012, Emerald Group Publishing Limited

Related articles