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New lifecycle monitoring system for electronic manufacturing with embedded wireless components

Axel Bindel (Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, UK)
Paul Conway (Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, UK)
Laura Justham (Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, UK)
Andrew West (Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, UK)

Circuit World

ISSN: 0305-6120

Article publication date: 18 May 2010

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Abstract

Purpose

The purpose of this paper is to present an update of and the latest results from work on a project aimed at monitoring electronic products during the whole life cycle with embedded wireless components.

Design/methodology/approach

Business processes of the electronic manufacturing supply chain were analysed. A business case and the system opportunities for life cycle monitoring, based on embedded wireless components system were developed. Radio frequency identification (RFID) assembly technology was adapted for the integration of components into a multi‐layer printed circuit board (PCB).

Findings

By storing product‐related information into electronic products, tracing of components, monitoring of processes, operations and costs, environmentally optimised recycling can be enhanced.

Research limitations/implications

The research undertaken so far relates to the embedding of RFID tags into PCBs. Wireless components with more processing power will be used in the next project phase.

Originality/value

The paper details how wireless components can be embedded into multi‐layer PCBs and how a business case for a life cycle monitoring system can be established.

Keywords

Citation

Bindel, A., Conway, P., Justham, L. and West, A. (2010), "New lifecycle monitoring system for electronic manufacturing with embedded wireless components", Circuit World, Vol. 36 No. 2, pp. 33-39. https://doi.org/10.1108/03056121011041681

Publisher

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Emerald Group Publishing Limited

Copyright © 2010, Emerald Group Publishing Limited