Is “black pad” still an issue for ENIG?

Abstract

Purpose

The purpose of this paper is to present a better understanding of nickel corrosion, also known as “black pad” during gold deposition of EN1G.

Design/methodology/approach

This paper presents an accumulation of personal experience and observations of the problem over a period of ten years. It incorporates the experience of the Global Trade Association connecting the electronic industries (IPC) plating committee as it set out to write the IPC electroless nickel‐immersion gold (ENIG) specification‐4552.

Findings

Understanding how corrosion occurs will go a long way in helping printed circuit board (PCB) manufacturers stay clear of the issue and make high quality ENIG finished PCBs.

Research limitations/implications

The majority of the data presented has been substantiated.

Originality/value

The paper details how, by good understanding of the mechanism of formation of corrosion products, manufacturers can steer clear from the problem.

Citation

Milad, G. (2010), "Is “black pad” still an issue for ENIG?", Circuit World, Vol. 36 No. 1, pp. 10-13. https://doi.org/10.1108/03056121011015040