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High quality laser cutting of electronic printed circuit board substrates

X.C. Wang (Singapore Institute of Manufacturing Technology (SIMTech), Singapore, Singapore)
H.Y. Zheng (Singapore Institute of Manufacturing Technology (SIMTech), Singapore, Singapore)

Circuit World

ISSN: 0305-6120

Article publication date: 20 November 2009

580

Abstract

Purpose

The purpose of this paper is to discuss laser cutting of FR4, and BT/Epoxy‐based PCB substrates with 355 nm DPSS UV laser.

Design/methodology/approach

The effects of various laser conditions such as scanning speed, assisting gas, repetition rate and interval between scans on the heat affected zone (HAZ) and charring are studied. The quality and morphology of laser cut PCB substrates are analyzed with optical microscopy, and scanning electron microscopy (SEM). Also, the laser cut PCB substrates are evaluated by humidity testing and thermal cycle testing.

Findings

Multi‐pass cutting at high scanning speed, with O2 assist gas was found to be able to achieve high quality cutting with little charring. It was also found that a certain time interval between scans and higher repetition rates led to a reduced heat affected zone and less charring.

Originality/value

This paper demonstrates high quality laser cutting of PCB substrates with no delamination, little charring and minimum HAZ. The developed process has important potential applications in the electronics industry.

Keywords

Citation

Wang, X.C. and Zheng, H.Y. (2009), "High quality laser cutting of electronic printed circuit board substrates", Circuit World, Vol. 35 No. 4, pp. 46-55. https://doi.org/10.1108/03056120911002415

Publisher

:

Emerald Group Publishing Limited

Copyright © 2009, Emerald Group Publishing Limited

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