Influences on the reflow soldering process by components with specific thermal properties

Abstract

Purpose

The purpose of the paper is to focus on the research into components with specific thermal properties and their influences on the reflow soldering process.

Design/methodology/approach

After a brief introduction, the paper gives an overview of the necessity of thermal management on printed circuit boards (PCBs) and the possible effects on the manufacturing of electronic devices. In the next sections, different test boards are presented for investigations into different thermal effects during soldering. The last section deals with the influences of molded interconnected devices (MIDs) on the reflow soldering process.

Findings

The investigations show that components from the thermal management influence the reflow soldering process more or less. The highest impacts on the soldering process are from components with a thermal connection to the electrical component and its solder joint. All results from the investigations have in common that the thermal influence can only be compensated by increasing the temperature during soldering. However, this significantly increases the risk of overheating the electrical components or the PCB itself.

Research limitations/implications

This paper shows only the influence of some of the effects caused by thermal management on the reflow soldering process. Furthermore, vapour phase soldering is not considered, but actual investigations are carried out on vapour phase soldering ovens as well.

Originality/value

Thermal management becomes more and more important with the increasing functionality of electrical components and electronic devices. This topic has been the subject of a large number of articles. However, this paper deals with influences that thermal management has on the soldering process during the manufacturing of the electronic device.

Citation

Schüßler, F., Kozic, D. and Franke, J. (2009), "Influences on the reflow soldering process by components with specific thermal properties", Circuit World, Vol. 35 No. 3, pp. 35-42. https://doi.org/10.1108/03056120910979530