A direct‐writing approach to the micro‐patterning of copper onto polyimide

Abstract

Purpose

The purpose of this paper is to present a novel manufacturing process that aims to pattern metal tracks onto polyimide at atmospheric pressure and ambient environment. The process can be scaled up for industrial applications.

Design/methodology/approach

From a thorough literature survey, different approaches were carried out for processing polyimide. Following a design of experiments for the processing and various characterisation techniques, a micro‐coil was manufactured as a test demonstrator.

Findings

The characteristics of some main formaldehyde‐based electroless copper baths were compared. The quality of the sidewalls was characterised and the performance of the process was assessed.

Originality/value

This paper demonstrates a high‐value manufacturing technique that is mass manufacturable, low cost and suitable for use on 3D surfaces. Criteria required for the development of a direct‐writing process have been described. The issues surrounding electroless plating on polyimide have been explained.

Citation

Ng, J.H.‐., Desmulliez, M.P.Y., Lamponi, M., Moffat, B.G., McCarthy, A., Suyal, H., Walker, A.C., Prior, K.A. and Hand, D.P. (2009), "A direct‐writing approach to the micro‐patterning of copper onto polyimide", Circuit World, Vol. 35 No. 2, pp. 3-17. https://doi.org/10.1108/03056120910953268