Low cost miniaturization of an implantable prototype

Abstract

Purpose

The purpose of this paper is to present the stages for manufacturing a low‐cost miniaturized prototype device, which observes the restrictions of implantable medical devices. The device measures the electrocardiography. The power for the implant is received passively as the same magnetic field as data is transferred to the reader device.

Design/methodology/approach

In this manufacturing technique, only easily attachable commercial available components are used, etching is used to simply produce a low‐cost double‐sided flexible printed circuit board which is converted to 3D by folding.

Findings

The circuit board was folded into the final shape after component attachment and the final result was a compact 3D package within the specifications determined by the electronics designer. The miniaturized prototype device was successfully tested both in vitro and in vivo.

Originality/value

The manufacturing technique of the sensing device can be readily adapted to other devices that need to be miniaturized. The coatings used for electrical insulation and chemical protection and the type of adhesives used for folded packages are easily utilized in similar miniaturization prototypes. By using bare chips, the final product would have been even smaller but for prototyping it is cheaper and faster to use easily acquired and attached components. In the case of mass production, the whole new design, where bare chips with flip chip attachments, integrated passives and/or stacked 3D packages with design considerations such as electrical, thermal and mechanical engineering is justified.

Citation

Heinilä, H., Riistama, J., Heino, P. and Lekkala, J. (2009), "Low cost miniaturization of an implantable prototype", Circuit World, Vol. 35 No. 1, pp. 34-40. https://doi.org/10.1108/03056120910928716