TY  - JOUR
AB  - Purpose– To present a simple way of assessing blind vias, making failure analysis easier to perform and generating less controversy.Design/methodology/approach– The paper describes a procedure that may be used to examine blind via hole interconnections for routine testing or during failure analysis of a printed circuit board.Findings– The technique described complements existing methods for assessing vias.Originality/value– The paper details a new method of via assessment that can be an alternative to established techniques.
VL  - 34
IS  - 2
SN  - 0305-6120
DO  - 10.1108/03056120810874564
UR  - https://doi.org/10.1108/03056120810874564
AU  - Willis Bob
PY  - 2008
Y1  - 2008/01/01
TI  - Assessment of blind via holes – an alternative approach
T2  - Circuit World
PB  - Emerald Group Publishing Limited
SP  - 34
EP  - 38
Y2  - 2024/09/24
ER  -