“Green” PCB production processes

Sven Lamprecht (Atotech Deutschland GmbH, Berlin, Germany)
Günter Heinz (Atotech Deutschland GmbH, Berlin, Germany)
Neil Patton (Atotech Deutschland GmbH, Berlin, Germany)
Stephen Kenny (Atotech Deutschland GmbH, Berlin, Germany)
Patrick Brooks (Atotech Deutschland GmbH, Berlin, Germany)

Circuit World

ISSN: 0305-6120

Publication date: 8 February 2008



The purpose of this paper is to show production process developments and innovations that resolve many of the issues faced with certain process steps for printed circuit board (PCB) manufacturing following “green” practices.


Several key PCB manufacturing processes have been developed or studied with respect to new environmental legislations and practises.


The introduction of new legislations designed to protect the environment require changes to laminate materials, solders, and PCB manufacturing techniques. The effect of new laminate materials on the desmearing and metallising processes have been assessed and recommendations given. The effect of increased thermal stress on plated copper has been assessed. Developments in adhesion enhancement for black oxide alternatives have been made and are presented with their suitability for the newer green laminate materials. The development of a new laminate manufacturing technique to reduce environmental impact is introduced. The capabilities of different surface finishes in relation to new lead‐free soldering techniques is investigated and presented.

Research limitations/implications

This is a short paper covering several major PCB processing steps and covers experiences and development results.


The paper details how “green” PCB manufacturing affects some key processes, developments to improve results and environmentally friendlier innovations in laminate manufacturing techniques.



Lamprecht, S., Heinz, G., Patton, N., Kenny, S. and Brooks, P. (2008), "“Green” PCB production processes", Circuit World, Vol. 34 No. 1, pp. 13-24. https://doi.org/10.1108/03056120810848752

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Copyright © 2008, Emerald Group Publishing Limited

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