The advantages of mildly alkaline immersion silver as a final finish for solderability
Abstract
Purpose
This study seeks to examine the advantages of mildly alkaline immersion silver as a final finish for solderability in order to combat the shortcomings of acidity in some popular immersion silver solutions.
Design/methodology/approach
The paper describes in detail the necessary steps in the mildly alkaline immersion silver process.
Findings
The process can overcome the problems of conventional acidic immersion silvers, especially in thermal shock and stress testing. Also it does not affect soldering or aluminium wire bonding.
Originality/value
This is arguably a pioneering study in that it posits the benefits of mildly alkaline immersion silver as a final finish for solderability.
Keywords
Citation
Li Fang, J. and Chan, D.K. (2007), "The advantages of mildly alkaline immersion silver as a final finish for solderability", Circuit World, Vol. 33 No. 2, pp. 43-51. https://doi.org/10.1108/03056120710750940
Publisher
:Emerald Group Publishing Limited
Copyright © 2007, Emerald Group Publishing Limited