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The advantages of mildly alkaline immersion silver as a final finish for solderability

Jing Li Fang (Chartermate Electronics Limited, Hong Kong, People's Republic of China)
Daniel K. Chan (Chartermate Electronics Limited, Hong Kong, People's Republic of China)

Circuit World

ISSN: 0305-6120

Article publication date: 22 May 2007

503

Abstract

Purpose

This study seeks to examine the advantages of mildly alkaline immersion silver as a final finish for solderability in order to combat the shortcomings of acidity in some popular immersion silver solutions.

Design/methodology/approach

The paper describes in detail the necessary steps in the mildly alkaline immersion silver process.

Findings

The process can overcome the problems of conventional acidic immersion silvers, especially in thermal shock and stress testing. Also it does not affect soldering or aluminium wire bonding.

Originality/value

This is arguably a pioneering study in that it posits the benefits of mildly alkaline immersion silver as a final finish for solderability.

Keywords

Citation

Li Fang, J. and Chan, D.K. (2007), "The advantages of mildly alkaline immersion silver as a final finish for solderability", Circuit World, Vol. 33 No. 2, pp. 43-51. https://doi.org/10.1108/03056120710750940

Publisher

:

Emerald Group Publishing Limited

Copyright © 2007, Emerald Group Publishing Limited

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