New materials and build‐up constructions for advanced rigid‐flex PCB applications

Tarja Rapala‐Virtanen (Aspocomp, Salo, Finland)
Timo Jokela (Aspocomp, Salo, Finland)

Circuit World

ISSN: 0305-6120

Publication date: 1 December 2005



This paper aims to explain how the goals have been met to manufacture rigid‐flex printed circuit boards (PCBs) in equipment used for rigid PCBs by utilizing new materials and process combinations.


A discussion of the technology and applications.


The main drivers for PCB technology have been size reduction, increased resolution, improved high frequency performance together with increased reliability and cost savings. To reach higher packaging density at the PCB level, Aspocomp has developed the technology with embedded active and passive components. However, in higher packaging density applications, the PCB‐technology has to offer more flexibility to PCB‐designers in order to effectively utilize space inside the electronic devices. Different flexible PCB solutions are needed to achieve this goal.

Practical implications

For fabricators of rigid PCBs there are challenges in production to adopt the new industry requirements.


This paper is of value to those involved with or interested in PCB technology.



Rapala‐Virtanen, T. and Jokela, T. (2005), "New materials and build‐up constructions for advanced rigid‐flex PCB applications", Circuit World, Vol. 31 No. 4, pp. 21-24.

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Copyright © 2005, Emerald Group Publishing Limited

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