Characterization of PCB plated‐through‐hole reliability using statistical analysis

Abstract

Various test methods are used to characterize PCB plated‐through‐hole reliability. One such method is the interconnect stress test. The results from this test are often used to qualify PCB materials and/or fabricators. This paper will discuss how certain statistical analysis techniques may be used to decipher the results, and predict capabilities of PCB materials and/or processes.

Citation

Tardibuono, M.J. (2005), "Characterization of PCB plated‐through‐hole reliability using statistical analysis", Circuit World, Vol. 31 No. 1, pp. 8-15. https://doi.org/10.1108/03056120510553176