A novel method for sequentially‐building multi‐layer circuits using LCP laminates, cap‐layers and bond plys

Cliff Roseen (Rogers Corporation, Rogers, Connecticut, USA)

Circuit World

ISSN: 0305-6120

Publication date: 1 December 2004

Abstract

Development efforts at Rogers are continuing on R/flex® liquid crystalline polymer (LCP) materials for printed circuit production. As an extension of our EIPC Spring 2003 paper, work has been completed on a novel method for sequentially building multi‐layer circuit boards using our laminates, bond plys and cap layers manufactured from various melt‐point LCP dielectric films. This paper discusses the theory and practice of sequentially built multilayers in all‐LCP and mixed dielectric constructions, reviews the pertinent processing steps and guidelines necessary for production and subsequent assembly thereafter, and considers some of the application areas that may benefit from this novel fabrication strategy.

Keywords

Citation

Roseen, C. (2004), "A novel method for sequentially‐building multi‐layer circuits using LCP laminates, cap‐layers and bond plys", Circuit World, Vol. 30 No. 4, pp. 40-43. https://doi.org/10.1108/03056120410539902

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Publisher

:

Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited

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