High‐performance substrate from new epoxy resin and enhanced copper foil

Ludovic Valette (Dow Deutschland GmbH & Co. OHG, Rheinmuenster, Germany)
Rudolf Wiechmann (Gould Electronics GmbH & Co. KG, Eichstetten, Germany)

Circuit World

ISSN: 0305-6120

Publication date: 1 December 2004

Abstract

The Dow Chemical Company has developed a new epoxy‐based system to serve the growing need for high‐performance dielectric substrates, requiring high thermal reliability (high Tg, high thermal resistance) and high signal speed and integrity (low dielectric constant and low loss factor). The system is based on advanced, proprietary resin technologies. The process latitude of this system is very similar to traditional high Tg FR‐4 products. The optimized rheology of the system leads to consistent, controlled flow. The copper foil JTCHTEAB from Gould Electronics, where AB stands for advanced bond, is interesting in this context as it was developed for use on high‐performance laminates with a typically lower ability for copper bonding, such as high Tg and low Dk/Df substrates. When the “LDk‐HTd” resin is used in combination with the JTCHTEAB copper foil, the copper peel strength fully meets the industry standard for high Tg FR‐4 laminates.

Keywords

Citation

Valette, L. and Wiechmann, R. (2004), "High‐performance substrate from new epoxy resin and enhanced copper foil", Circuit World, Vol. 30 No. 4, pp. 20-26. https://doi.org/10.1108/03056120410539876

Download as .RIS

Publisher

:

Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited

Please note you might not have access to this content

You may be able to access this content by login via Shibboleth, Open Athens or with your Emerald account.
If you would like to contact us about accessing this content, click the button and fill out the form.
To rent this content from Deepdyve, please click the button.