TY  - JOUR
AB  - Printed circut boards (PCBs) have diminished in size and, simultaneously, their circuit densities have increased. Conventional multi‐layered PCBs have a limitation to higher packaging densities. This paper introduces a new copper electroplating formula that is able to fill vias and through holes simultaneously and is used in a DC plating method, in which the copper thickness deposited on the board surface is relatively very thin after the electroplating is completed.
VL  - 30
IS  - 3
SN  - 0305-6120
DO  - 10.1108/03056120410520597
UR  - https://doi.org/10.1108/03056120410520597
AU  - Dow Wei‐Ping
AU  - Chen Hsiang‐Hao
PY  - 2004
Y1  - 2004/01/01
TI  - A novel copper electroplating formula for laser‐drilled micro via and through hole filling
T2  - Circuit World
PB  - Emerald Group Publishing Limited
SP  - 33
EP  - 36
Y2  - 2024/04/19
ER  -