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A novel copper electroplating formula for laser‐drilled micro via and through hole filling

Wei‐Ping Dow (Department of Chemical Engineering, National Yunlin University of Science and Technology, Taiwan)
Hsiang‐Hao Chen (Department of Chemical Engineering, National Yunlin University of Science and Technology, Taiwan)

Circuit World

ISSN: 0305-6120

Article publication date: 1 September 2004

Abstract

Printed circut boards (PCBs) have diminished in size and, simultaneously, their circuit densities have increased. Conventional multi‐layered PCBs have a limitation to higher packaging densities. This paper introduces a new copper electroplating formula that is able to fill vias and through holes simultaneously and is used in a DC plating method, in which the copper thickness deposited on the board surface is relatively very thin after the electroplating is completed.

Keywords

Citation

Dow, W. and Chen, H. (2004), "A novel copper electroplating formula for laser‐drilled micro via and through hole filling", Circuit World, Vol. 30 No. 3, pp. 33-36. https://doi.org/10.1108/03056120410520597

Publisher

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Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited