Micro via filling plating technology for IC substrate applications

Abstract

The trend of electronic products toward lighter, thinner, and faster transmission is challenging the printed circuit board industry to incorporate high density interconnection technology (such as build‐up and semi‐additive processes). Micro stacked via is one technology utilized to produce high‐density structures. Dielectric resin, conductive paste or via plating are usually applied for the filling process. As compared with other filling methods, via filling plating technology has advantages in offering a shorter process and higher reliability. This paper discusses the influence of different equipment design, operating conditions and additives on via filling plating technology.

Citation

Yeh, C., Lan, K., Dow, W., Hsu, J., Lee, C., Hsu, C., Lee, K., Chen, J. and Lu, P. (2004), "Micro via filling plating technology for IC substrate applications", Circuit World, Vol. 30 No. 3, pp. 26-32. https://doi.org/10.1108/03056120410520588