TY  - JOUR
AB  - This paper focuses on the renewed interest in the use of condensation, or vapour‐phase, soldering in lead‐free surface mount assembly soldering and notes also the corresponding legislation, which will preclude the use of lead‐based solders in most applications by 2006. The process is once again becoming popular, because of the absolute control of soldering temperature, and because high‐quality batch and in‐line equipment is now available. It notes that condensation heating with perfluorocarbon liquids and present well‐designed equipment can be used not only in the mass‐assembly of electronic circuit boards, but also for a large variety of other heating tasks in many industries.
VL  - 30
IS  - 3
SN  - 0305-6120
DO  - 10.1108/03056120410520579
UR  - https://doi.org/10.1108/03056120410520579
AU  - Wood Russ
PY  - 2004
Y1  - 2004/01/01
TI  - A new phase for vapour‐phase – an overview of the current status of vapour phase technology for soldering and related applications
T2  - Circuit World
PB  - Emerald Group Publishing Limited
SP  - 21
EP  - 25
Y2  - 2024/04/25
ER  -