This paper focuses on the renewed interest in the use of condensation, or vapour‐phase, soldering in lead‐free surface mount assembly soldering and notes also the corresponding legislation, which will preclude the use of lead‐based solders in most applications by 2006. The process is once again becoming popular, because of the absolute control of soldering temperature, and because high‐quality batch and in‐line equipment is now available. It notes that condensation heating with perfluorocarbon liquids and present well‐designed equipment can be used not only in the mass‐assembly of electronic circuit boards, but also for a large variety of other heating tasks in many industries.
Wood, R. (2004), "A new phase for vapour‐phase – an overview of the current status of vapour phase technology for soldering and related applications", Circuit World, Vol. 30 No. 3, pp. 21-25. https://doi.org/10.1108/03056120410520579Download as .RIS
Emerald Group Publishing Limited
Copyright © 2004, Emerald Group Publishing Limited