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Process development for PWB compatible embedded capacitors

Swapan K. Bhattacharya (School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA)
P. Markondeya Raj (School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA)
Devarajan Balaraman (School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA)
Hitesh Windlass (School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA)
Rao R. Tummala (School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA)

Circuit World

ISSN: 0305-6120

Article publication date: 1 March 2004

531

Abstract

This paper addresses materials and processes for printed wiring board compatible embedded capacitors using polymer/ceramic nanocomposites and hydrothermal barium titanate. Polymers allow low temperature fabrication appropriate to the board (MCM‐L) technology. The lower dielectric constants of the commercially available polymers can be greatly compensated by incorporating higher permittivity ceramic fillers. Materials requirements for higher capacitance density (>30 nF/cm2) have been addressed through implementation of a novel low‐temperature processable hydrothermal barium titanate film on a patterned titanium foil laminated to the PWB. Application of hydrothermal grown barium titanate is currently being evaluated using a multi‐layer system‐on‐package demonstration.

Keywords

Citation

Bhattacharya, S.K., Markondeya Raj, P., Balaraman, D., Windlass, H. and Tummala, R.R. (2004), "Process development for PWB compatible embedded capacitors", Circuit World, Vol. 30 No. 1, pp. 31-35. https://doi.org/10.1108/03056120410496360

Publisher

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Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited

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