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The new immersion tin generation in practical operation – a surface finish process including the world's first organic metal

Sabine Schröder (Ormecon Chemie GmbH and Co. KG, Ammersbek, Germany)

Circuit World

ISSN: 0305-6120

Article publication date: 1 March 2003

273

Abstract

This paper describes the properties of a new generation of immersion tin as a solderable surface finish for printed circuit boards. The new process combines the unique technology of Organic Metals with the well introduced technology of immersion tin. A comparison with other solderable surface finishes will show the advantages and superior performance for PCB manufacturer, assemblers and OEMs.

Keywords

Citation

Schröder, S. (2003), "The new immersion tin generation in practical operation – a surface finish process including the world's first organic metal", Circuit World, Vol. 29 No. 1, pp. 10-13. https://doi.org/10.1108/03056120310444133

Publisher

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MCB UP Ltd

Copyright © 2003, MCB UP Limited

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