The new immersion tin generation in practical operation – a surface finish process including the world's first organic metal
Abstract
This paper describes the properties of a new generation of immersion tin as a solderable surface finish for printed circuit boards. The new process combines the unique technology of Organic Metals with the well introduced technology of immersion tin. A comparison with other solderable surface finishes will show the advantages and superior performance for PCB manufacturer, assemblers and OEMs.
Keywords
Citation
Schröder, S. (2003), "The new immersion tin generation in practical operation – a surface finish process including the world's first organic metal", Circuit World, Vol. 29 No. 1, pp. 10-13. https://doi.org/10.1108/03056120310444133
Publisher
:MCB UP Ltd
Copyright © 2003, MCB UP Limited