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Imprint patterning: a novel method for producing high density interconnects

George Gregoire (Dimensional Circuits Corporation, San Diego, USA)

Circuit World

ISSN: 0305-6120

Article publication date: 1 December 2002



Imprint patterning is a new circuit formation process that is based on a well‐established technology called microreplication. Microreplication has been used for many years for making a diverse range of products such as compact discs (CDs), roadside reflective signs and even holographic wrapping paper. As is the case with printed circuit boards microreplication is typically practised where the surface features are very small in relation to the length and width of the product. This paper reports details of a new and potentially disruptive technology that draws on a well‐established imprinting process to provide a comparatively low cost and shorter route to the fabrication of high density interconnections and microvias.



Gregoire, G. (2002), "Imprint patterning: a novel method for producing high density interconnects", Circuit World, Vol. 28 No. 4, pp. 33-37.




Copyright © 2002, MCB UP Limited

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