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Analysis and comparison of WLCSP‐on‐build‐up PCB assemblies with various solders and microvia configurations

S.‐W. Ricky Lee (Agilent Technologies, San Jose, California, USA)
John H. Lau (Agilent Technologies, San Jose, California, USA)

Circuit World

ISSN: 0305-6120

Article publication date: 1 June 2002

275

Abstract

In this paper, a computational analysis is presented for the comparison of wafer level chip scale package‐on‐build‐up PCB assemblies with various solders and microvia configurations. The printed circuit board of the assembly has one build‐up layer on one side. For comparison, the board with two build‐up layers on the same side is studied as well. Furthermore, two solder joint materials, namely, 62Sn–2Ag–36Pb and 96.5Sn–3.5Ag are studied for comparison. The assembly is simulated by a finite element model and the model is analyzed under thermal cyclic loading. A comprehensive stress analysis is performed and comparisons are made for assembly deformation, stress/strain ranges, and creep responses.

Keywords

Citation

Ricky Lee, S.‐. and Lau, J.H. (2002), "Analysis and comparison of WLCSP‐on‐build‐up PCB assemblies with various solders and microvia configurations", Circuit World, Vol. 28 No. 2, pp. 32-38. https://doi.org/10.1108/03056120210412535

Publisher

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MCB UP Ltd

Copyright © 2002, MCB UP Limited

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