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Solder bridging test to evaluate the compatibility for fine‐pitch microsoldering

Tadashi Takemoto (Joining and Welding Research Institute, Osaka University, Osaka, Japan)
Tatsuya Funaki (Graduate Student, Osaka University, Osaka, Japan)
Makoto Miyazaki (Graduate Student, Graduate School of Osaka University, Osaka, Japan)
Akira Matsunawa (Joining and Welding Research Institute, Osaka University, Osaka, Japan)

Circuit World

ISSN: 0305-6120

Article publication date: 1 January 1998

41

Abstract

Establishes a quantitative evaluation method on solder bridging in microsoldering using a printed wiring board with comb pattern conductors. Bridge tests were conducted by immersing the comb pattern board into a molten solder bath. The total length of solder bridge between conductors against the total length between conductors was measured as a measure of the occurrence of solder bridging. The occurrence of bridging depended on the number of immersions, flux activity including solid content, conductor spacing, solder bath temperature and solder composition. The increase in number of immersion enhanced bridging. The rosin flux without activators showed higher bridging than the activated flux. Sn‐37Pb solder showed lower bridging than Sn‐3.5Ag‐5Bi solder. Solder bridging was found to be closely correlated with wettability, therefore, the improvement of wettability could be effective to suppress solder bridging. The proposed method is believed to be suitable for the quantitative evaluation of solder bridging.

Keywords

Citation

Takemoto, T., Funaki, T., Miyazaki, M. and Matsunawa, A. (1998), "Solder bridging test to evaluate the compatibility for fine‐pitch microsoldering", Circuit World, Vol. 24 No. 1, pp. 39-44. https://doi.org/10.1108/030561201998000007

Publisher

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MCB UP Ltd

Copyright © 1998, MCB UP Limited

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