Reliability of flip chips on FR‐4 assembled with reduced process steps

Abstract

This paper discusses processes of flip chip on FR‐4 using eutectic solder bumps with possible fewer process steps compared to the full assembly process. Some interesting results in terms of the reliability performance of flip chip on FR‐4 assemblies using eutectic solder have been obtained after an almost‐one‐year temperature cycling test. The process steps of underfilling and curing of underfill can be omitted when a suitable epoxy is used for encapsulation. When underfill is conducted, encapsulation is not necessarily needed from a reliability point of view.

Citation

Zhong, Z. (2001), "Reliability of flip chips on FR‐4 assembled with reduced process steps", Circuit World, Vol. 27 No. 3, pp. 26-30. https://doi.org/10.1108/03056120110385474