New halogen‐free materials for PWB, HDI and advanced package substrate

Abstract

Recently, the requirement of the printed wiring boards (PWBs) of environmental harmony type has risen rapidly. We have developed the core technologies of halogen‐free. They consist of resin system technology and high filler content technology. The point of the resin technology is the development of a new resin system (RO resin) which takes nitrogen into the molecule frame in a large quantity. The point of the high filler content technology is the development of a new filler interphase control system (FICS) which enables the high dispersion of fillers. A variety of halogen‐free substrates which can be applied to the diversified needs have been developed by combining these technologies. They are MCL‐RO‐67G, thin laminate for the multi‐layer PWBs, MCF‐4000G, build‐up material for high density interconnect (HDI) , and MCL‐E‐679F(G), high Tg laminate for the advanced plastic IC packages (PKGs) and PWBs. These materials have excellent heat‐resistance, and are suitable for lead‐free solder as well. The robustness towards temperature, humidity and frequency of those materials is better than that of current materials. The synthetic board design of the environmental harmony type is facilitated by combined use of these materials. We are also developing several multi‐layer and build‐up materials, HDI for high frequency, high speed and high reliability application to meet the requirement of PWBs and advanced PKGs for the near future.

Citation

Murai, H., Takeda, Y., Takano, N. and Ikeda, K. (2001), "New halogen‐free materials for PWB, HDI and advanced package substrate", Circuit World, Vol. 27 No. 2, pp. 7-11. https://doi.org/10.1108/03056120110380758