In September 1996 six leading European companies all involved in printed wiring board (PWB) manufacturing and electronic packaging decided to start a common development project. The “FLINT ‐ fine line interconnect” project was born. One main objective of the project is to develop fine‐line technologies for PWBs down to 50μm lines and spaces up to high volume capability. Additionally, laser‐ and photo‐processes for microvia formation down to 50μm diameter have been developed and compared. For the precise ablation of the soldermask as required for flip‐chip assembly a laser process has been developed. Functional demonstrators and test vehicles have been built using a range of build‐up dielectrics to prove the reliability of the new technologies. The project will be finished in December 1999. This paper presents some results of the FLINT project.
Griesinger, A. and Guenther, B. (2000), "FLINT ‐ fine line interconnect ‐ project: development of technologies for the production of HDI‐boards", Circuit World, Vol. 26 No. 1, pp. 19-21. https://doi.org/10.1108/03056120010302160
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