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Modeling of coupled heat, moisture transfer and mechanical deformations of wood during drying process

Zhenggang Zhu (Institute for Structural Analysis, Technische Universität Dresden, Dresden, Germany)
Michael Kaliske (Institute for Structural Analysis, Technische Universität Dresden, Dresden, Germany)

Engineering Computations

ISSN: 0264-4401

Publication date: 11 October 2011

Abstract

Purpose

The purpose of this paper is to present a numerical model of coupled heat, moisture transfer and their effects on the mechanical deformations of wood during the drying process.

Design/methodology/approach

Coupling among heat, moisture, and mechanical deformations is solved consecutively by use of sparse solver of MATLAB. The weighted residual of the equilibrium equations of drying process of wood, based on finite element method, is investigated. The stress and plastic strain increments can be solved with Newton's method.

Findings

The numerical model is applied to a plain strain problem of a long wood board taken from the outer region of the wood log. Numerical simulation reveals the stress reversal during the drying process. The mechanical deformations and the principle stresses of a three‐dimensional wood board in consideration of the orthotropic properties are presented.

Originality/value

Plane strain and plane stress are analysed. The tangential modulus is derived. The transformation of the stress and strain tensors between the local coordinate system resulting from the cylindrical properties of wood and the global one is evaluated. Selection of element type for temperature, moisture content and displacement is discussed.

Keywords

Citation

Zhu, Z. and Kaliske, M. (2011), "Modeling of coupled heat, moisture transfer and mechanical deformations of wood during drying process", Engineering Computations, Vol. 28 No. 7, pp. 802-827. https://doi.org/10.1108/02644401111165103

Publisher

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Emerald Group Publishing Limited

Copyright © 2011, Emerald Group Publishing Limited