TY - JOUR AB - Purpose– Electrical impedance measurement and imaging are techniques that are widely used in a range of applications. Electro‐conductive knitted structure is a major new development in wearable computing. The purpose of this paper is to carry out a preliminary investigation of applying electrical impedance analysis to predict the behavior of electro‐conductive knitted structure. This can potentially pave the way for a low‐cost solution for pressure mapping imaging.Design/methodology/approach– Electrical impedance tomography (EIT) has been used as a mapping technique for deformation imaging in conductive knitted fabric. EIT is an imaging system used to generate a map of electrical conductivity. Pressure and deformation mapping scanner is being developed based on electrical conductivity imaging of the conductive area generated in a fabric. The results are presented using these new sensors with various deformations.Findings– Experimental results show the feasibility of qualitative deformation imaging. In particular, it is promising that multiple deformations can be mapped using the proposed technique. The paper also demonstrates preliminary results regarding quantitative pressure and deformation mapping using EIT technique.Research limitations/implications– The results presented in the paper are laboratory‐based experiments for proof of principle and will be evaluated in specific application areas in future.Originality/value– The paper shows, for the first time, detection of multiple pressure points as well as quantifying the pressure map using the new imaging sensor. The sensor proposed here can be used for robotic touch sensing application, as well as some biomechanical observations. VL - 32 IS - 4 SN - 0260-2288 DO - 10.1108/02602281211257542 UR - https://doi.org/10.1108/02602281211257542 AU - Yao A. AU - Soleimani M. PY - 2012 Y1 - 2012/01/01 TI - A pressure mapping imaging device based on electrical impedance tomography of conductive fabrics T2 - Sensor Review PB - Emerald Group Publishing Limited SP - 310 EP - 317 Y2 - 2024/03/28 ER -