The purpose of this paper is to explore progress in electronic circuit miniaturisation, and study the new medical sensor devices emerging.
Circuit packaging advances in the mobile phone sector are examined. The products and expertise of a leading producer of non‐contact sensors and medical implants are described, followed by a series of medical applications of 3D circuitry.
Mobile phone enhancements are driving innovations in electronics that are transferable to other industries. Wafer‐thinning and 3D interconnection techniques shrink complex circuitry, enabling the construction of sensitive intelligent wireless sensors. Biologically inert packaging enables such devices to be implanted in the human body to improve sight and hearing, and monitor bone‐healing after surgery.
The paper shows how electronic packaging innovations are spinning out into non‐contact sensors and medical implants and will be of interest to engineers in these fields, and of general interest to a wider readership.
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