This paper aims to discuss the new applications enabled by printed sensors.
The paper discusses how silicon‐based sensors are manufactured using the time‐consuming, expensive, and complicated fabrication process of traditional semiconductor devices and shows what is needed in order to produce such new devices with the advantages of printed sensors.
With new materials, new processing technologies and a new manufacturing process, thin, flexible, lightweight, cost‐effective sensors are made possible through the power of printed semiconductors.
This paper should be of value in terms of understanding the pros of printed semiconductors and the resulting sensors which have a number of unique mechanical, electrical, and optical properties.
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