TY  - JOUR
AB  - Explains how automated dispensers are used to deposit surface mount device adhesives, and solder paste and other “fluids”. Looks at the features and capabilities of today’s equipment and dispenses advice on using it effectively.
VL  - 16
IS  - 4
SN  - 0144-5154
DO  - 10.1108/01445159610151025
UR  - https://doi.org/10.1108/01445159610151025
AU  - Stokes Philip
PY  - 1996
Y1  - 1996/01/01
TI  - Automated dispensing in surface mount assembly
T2  - Assembly Automation
PB  - MCB UP Ltd
SP  - 30
EP  - 33
Y2  - 2024/04/25
ER  -