Soldering with light!

Abstract

With the ever‐decreasing size of electronic components, examines the use of laser soldering, particularly of fine‐pitch, high value devices. Discusses the advantages and disadvantages of using lasers and the applications to which they are suited. Looks at the different types of lasers and how their different wavelength of operation affects the soldering process. Describes an experimental laser soldering station and its ability to solder circuit boards. Concludes that modern electronic component packaging technology is demanding new techniques for the interconnection of devices, and that the application of lasers to the traditional technique of soldering will enable this tested process to be applicable to the very fine pitch devices now being introduced.

Citation

Whitehead, D.G. and Foster, R.J. (1995), "Soldering with light!", Assembly Automation, Vol. 15 No. 2, pp. 17-19. https://doi.org/10.1108/01445159510146978