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Recent developments in adhesive technology: a review

Robert Bogue (Okehampton, UK)

Assembly Automation

ISSN: 0144-5154

Article publication date: 2 August 2011

Abstract

Purpose

This paper aims to provide an insight into recent developments in adhesive technology.

Design/methodology/approach

Following a brief introduction, this paper discusses recent developments in biomimetic adhesives, the use of nanomaterials and “smart” adhesive technology.

Findings

Biomimetic dry adhesive technology has advanced very rapidly in recent years and techniques to mass‐produce these materials are now under development. The use of nanomaterials is being investigated widely and recent research suggests that adhesives with enhanced mechanical, thermal and electrical properties will emerge. Smart adhesives, such as switchable types which can be triggered to bond and de‐bond in response to physical or chemical stimuli are under development and some are already available commercially. These will contribute to product disassembly and recycling.

Originality/value

This paper provides a review of recent R&D into three fields of adhesive technology that are presently attracting strong interest.

Keywords

Citation

Bogue, R. (2011), "Recent developments in adhesive technology: a review", Assembly Automation, Vol. 31 No. 3, pp. 207-211. https://doi.org/10.1108/01445151111150532

Publisher

:

Emerald Group Publishing Limited

Copyright © 2011, Emerald Group Publishing Limited