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Bulk nanostructure and amorphous metallic components using the electrospark welding process

M. Brochu (Department of Mining and Materials Engineering, McGill University, Montreal, Canada)
D.W. Heard (Department of Mining and Materials Engineering, McGill University, Montreal, Canada)
J. Milligan (Department of Mining and Materials Engineering, McGill University, Montreal, Canada)
S. Cadney (Department of Mining and Materials Engineering, McGill University, Montreal, Canada)

Assembly Automation

ISSN: 0144-5154

Article publication date: 3 August 2010

536

Abstract

Purpose

The purpose of this paper is to outline the feasibility of using the electrospark welding (ESW) process to free‐form metallic components with nanostructured or amorphous microstructures.

Design/methodology/approach

ESW was used to deposit amorphous and nanostructure coatings for high‐wear resistance applications. The ESW process was also used to freeform three‐dimensional objects via multiple deposition passes. The near‐net shape capability is interesting as it significantly reduces the post‐processing operations.

Findings

This paper demonstrates that it is possible and economically feasible to produce components possessing metastable structures, i.e. nano or amorphous, using the ESW process.

Practical implications

The ESW process possesses the ability to manufacture advanced materials and can pattern surfaces to provide appropriate functionality with respect to the service environment.

Originality/value

This paper represents a summary of the capabilities of ESW to fabricate advanced materials and is based on the achievements of our laboratory. In particular, results on ESW of amorphous materials and the ability to produce coatings with second phase particles refined to this extent have not been achieved using other manufacturing methods.

Keywords

Citation

Brochu, M., Heard, D.W., Milligan, J. and Cadney, S. (2010), "Bulk nanostructure and amorphous metallic components using the electrospark welding process", Assembly Automation, Vol. 30 No. 3, pp. 248-256. https://doi.org/10.1108/01445151011061145

Publisher

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Emerald Group Publishing Limited

Copyright © 2010, Emerald Group Publishing Limited

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