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Development and error compensation of laser soldering system

Zhenhua Xiong (State Key Laboratory of Mechanical System and Vibration, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, People's Republic of China)
Xinjue Zou (State Key Laboratory of Mechanical System and Vibration, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, People's Republic of China)
Yulin Wang (State Key Laboratory of Mechanical System and Vibration, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, People's Republic of China)
Han Ding (State Key Laboratory of Mechanical System and Vibration, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, People's Republic of China)

Assembly Automation

ISSN: 0144-5154

Article publication date: 3 August 2010

357

Abstract

Purpose

Accurate alignment is vital to acquire high‐quality joints with less negative effects on the rest parts of the chip or other components on a board. The purpose of this paper is to develop an integrated laser soldering system, which is accurate, compact, and flexible.

Design/methodology/approach

The system combines an XY stage, a computer vision module and a laser module. It would automatically sense the soldering pads with computer vision, fulfill the alignment of laser beam and soldering pads together with the motion system, and finish the soldering work with laser power.

Findings

Based on the analysis of experimental data, it is found that lens distortion and assembly angular errors of the XY stage play a distinct role on the alignment errors.

Originality/value

The paper proposes an algorithm based on straight line method to reduce image distortion, and a compensation algorithm on the angular errors of the XY positioning stage. Experimental results show that the overall precision is satisfied for fine pitch applications and the system performs well.

Keywords

Citation

Xiong, Z., Zou, X., Wang, Y. and Ding, H. (2010), "Development and error compensation of laser soldering system", Assembly Automation, Vol. 30 No. 3, pp. 213-220. https://doi.org/10.1108/01445151011061109

Publisher

:

Emerald Group Publishing Limited

Copyright © 2010, Emerald Group Publishing Limited

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