The fabrication and assembly of nanoelectronic devices

Abstract

Purpose

The purpose of this paper is to provide a review of recent developments in nanoelectronic devices, with an emphasis on the materials and fabrication technologies employed.

Design/methodology/approach

This paper focuses on three critical fields of nanoelectronics: integrated circuits (ICs), sensors and displays. It describes recent developments and considers the materials and techniques used in their fabrication.

Findings

This paper shows that nanoelectronic developments, particularly experimental ICs, are progressing very rapidly but all manner of different materials and non‐standard fabrication processes are involved. Major efforts are underway to develop simple and cost‐effective techniques which will allow the high volume production of suitable nanomaterials and their incorporation into commercial nanoelectronic devices.

Originality/value

The paper provides an up‐to‐date review of nanoelectronic device developments and fabrication technologies.

Citation

Bogue, R. (2010), "The fabrication and assembly of nanoelectronic devices", Assembly Automation, Vol. 30 No. 3, pp. 206-212. https://doi.org/10.1108/01445151011061091