TY  - JOUR
AB  - Purpose– The purpose of this paper is to explain the growing importance of design for assembly (DFA) and design for test (DFT) for compact medical electronics products.Design/methodology/approach– The paper discusses compact products based on leading‐edge electronic components such as digital signal processors, radio frequency (RF) and mixed‐signal chips, advanced ball‐grid array, quad flat pack, chip scale package devices.Findings– Advanced technologies like these create higher component and joint counts and increasing PCB densities. A higher probability of defects and faults is created, which lead to lower yields for a specific product line unless proper effective DFA and DFT are implemented.Practical implications– The paper details DFA, high‐speed PCB design, mixed‐signal design, and DFT.Originality/value– With increasing complexity in compact medical products, it is prudent to emphasize DFA and DFT for ultimate reliability during product development and production cycles.
VL  - 28
IS  - 3
SN  - 0144-5154
DO  - 10.1108/01445150810889961
UR  - https://doi.org/10.1108/01445150810889961
AU  - Khan Zulki
ED  - Christoph Hanisch
PY  - 2008
Y1  - 2008/01/01
TI  - Design for assembly
T2  - Assembly Automation
PB  - Emerald Group Publishing Limited
SP  - 200
EP  - 206
Y2  - 2024/05/14
ER  -