In‐house development of low cost automatic IC workcell for BGA solder ball attachment

Kam Fai Dick Tam (SAE Magnetics (H.K.) Ltd, SAE Technology Centre, Hong Kong)
Ching Yuen Chan (Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Kowloon, Hong Kong)
W.H. Ip (Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Kowloon, Hong Kong)
Chi Shing Jackson Tang (Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Kowloon, Hong Kong)

Assembly Automation

ISSN: 0144-5154

Publication date: 1 August 2008

Abstract

Purpose

The purpose of this paper is to develop a cost effective ball grid array (BGA) workcell for solder ball attachment.

Design/methodology/approach

This paper presents the construction of a low‐cost high‐efficiency automatic ball attachment workcell. In fact, it is an economical means of simultaneous placement of all solder balls on BGA substrates containing multiple BGA units as well as singulated substrates. Common industry problems such as the effect of static charges, the solder ball oxidation, the missing ball, the extra ball, the ball alignment, the deformed ball and, etc. will be addressed and critical issues affecting yield will also be discussed in this paper.

Findings

BGA is a popular integrated circuit packaging that is often applied in laptop computers and other handheld electronic devices for the provision of a high‐connection count in a relatively small area. However, the cost of a market available BGA solder ball attachment workcell is very expensive and the flexibility in fitting various customized process is usually low.

Originality/value

The developed workcell cost is about half of the market available machines with similar specifications; the yield achieved is within three sigma confidence interval with competitive output rate. The maintenance and troubleshooting are easy since the machine was developed by the in‐house engineering team.

Keywords

Citation

Fai Dick Tam, K., Yuen Chan, C., Ip, W.H. and Shing Jackson Tang, C. (2008), "In‐house development of low cost automatic IC workcell for BGA solder ball attachment", Assembly Automation, Vol. 28 No. 3, pp. 255-261. https://doi.org/10.1108/01445150810889510

Publisher

:

Emerald Group Publishing Limited

Copyright © 2008, Emerald Group Publishing Limited

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