The purpose of this paper is to provide a review of recent progress in self‐assembly technology, principally in the microelectronics context.
First, the paper discusses the application of nanoscale self‐assembly techniques to microelectronic and related components and then considers research involving larger devices.
The paper shows that a range of self‐assembly techniques is being used to fabricate both production and experimental microelectronic devices, often with the aim of developing alternatives to copper wire interconnects. Other, experimental self‐assembly techniques are being developed for the packaging and mounting of microelectronic components on substrates.
Provides a useful, detailed review of the use of self‐assembly techniques at the nanoscale, microscale and macroscale.
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