TY  - JOUR
AB  - Purpose– This paper sets out to propose a wafer prealigner based on multi‐sensor integration and an effective prealignment method implemented on it.Design/methodology/approach– The wafer and notch eccentricities, on which wafer prealignment is based, are calculated with the peripheral data of the wafer detected by a laser displacement sensor and a transmission laser sensor by means of barycenter acquiring algorithm in a one‐particle system.Findings– The center and notch prealignment precisions of the system are, respectively, ±1.5 μm and ±30 μrad. Experimentation has proved the validity and effectiveness of the system.Practical implications– The wafer prealigner is a subsystem of the lithography in the semiconductor industry. The prealignment algorithm can be implemented in any object with random figures.Originality/value– The periphery of the wafer is detected by a high‐precision laser displacement sensor and a low‐cost transmission laser sensor instead of a CCD linear sensor used by traditional wafer prealigners, which saves the space occupation of the structure and enhances the systematic prealignment precision. Using barycenter acquiring algorithm in a one‐particle system to calculate the wafer and notch eccentricities is effective and valid.
VL  - 28
IS  - 1
SN  - 0144-5154
DO  - 10.1108/01445150810849046
UR  - https://doi.org/10.1108/01445150810849046
AU  - Huang Chunxia
AU  - Cao Qixin
AU  - Fu Zhuang
AU  - Leng Chuntao
PY  - 2008
Y1  - 2008/01/01
TI  - The development of a wafer prealigner based on the multi‐sensor integration
T2  - Assembly Automation
PB  - Emerald Group Publishing Limited
SP  - 77
EP  - 82
Y2  - 2024/04/24
ER  -