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A selective disassembly methodology for end‐of‐life products

S. Kara (School of Mechanical and Manufacturing Engineering, The University of New South Wales, Sydney, NSW, Australia)
P. Pornprasitpol (School of Mechanical and Manufacturing Engineering, The University of New South Wales, Sydney, NSW, Australia)
H. Kaebernick (School of Mechanical and Manufacturing Engineering, The University of New South Wales, Sydney, NSW, Australia)

Assembly Automation

ISSN: 0144-5154

Article publication date: 1 June 2005

3045

Abstract

Purpose

Aims to develop a selective disassembly methodology for generating an optimum disassembly sequence for end‐of‐life (EOL) products.

Design/methodology/approach

The paper presents a selective disassembly methodology for EOL products. In order to achieve this, Nevins and Whitney's methodology for assembly was modified. In addition, a Java‐based software was developed to speed up the generation of all possible disassembly sequences.

Findings

Finds that the methodology developed by Nevins and Whitney for assembly is applicable to disassembly process. In addition, the winnowing process for disassembly is much easier than for assembly because of the selective disassembly approach, which automatically provides a significant constraint on possible sequences.

Research limitations/implications

Provides an easy to use and visual disassembly sequence generation tool for end‐of‐life products.

Practical implications

Disassembly is one of the significant cost drivers in achieving close loop manufacturing. Application of the methodology proposed in this paper will significantly reduce the disassembly time by providing a disassembly sequence for the selected components with reuse potential.

Originality/value

Provides a graphical representation of disassembly sequences at different stages of the process, which allows the user to visualize the disassembly process.

Keywords

Citation

Kara, S., Pornprasitpol, P. and Kaebernick, H. (2005), "A selective disassembly methodology for end‐of‐life products", Assembly Automation, Vol. 25 No. 2, pp. 124-134. https://doi.org/10.1108/01445150510590488

Publisher

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Emerald Group Publishing Limited

Copyright © 2005, Emerald Group Publishing Limited

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