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The automated filling of bonded joints – Part 1 two dimensional joints

Ken Young (Ken Young, Ian Pearson and R. Bull are based at the Warwick Manufacturing Group, University of Warwick, CV4 7AL, Coventry, UK.)
Ian Pearson (Ken Young, Ian Pearson and R. Bull are based at the Warwick Manufacturing Group, University of Warwick, CV4 7AL, Coventry, UK.)
R. Bull (Ken Young, Ian Pearson and R. Bull are based at the Warwick Manufacturing Group, University of Warwick, CV4 7AL, Coventry, UK.)

Assembly Automation

ISSN: 0144-5154

Article publication date: 1 December 2002

324

Abstract

A parameter has been identified that can be used to calculate a joint's bond‐line thicknesses. This was successfully represented by a fourth order polynomial expression and has been used to predict the volume of adhesive required to precisely fill structural joints of unknown bond‐line thickness. This technology was further used to automatically control adhesive injection into pre‐assembled vehicle structural joints for use in an automated production environment. This has great advantage over adhesive application prior to joint assembly as the adhesive remains in the joint rather than contaminating the adherend surface and the bond‐line remains filled. This will be of benefit to the automotive industry. The method is adaptable and can be re‐programmed to cope with a number of applications.

Keywords

Citation

Young, K., Pearson, I. and Bull, R. (2002), "The automated filling of bonded joints – Part 1 two dimensional joints", Assembly Automation, Vol. 22 No. 4, pp. 343-349. https://doi.org/10.1108/01445150210446210

Publisher

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MCB UP Ltd

Copyright © 2002, MCB UP Limited

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