Corrosion of copper plates in presence of phosphoric acid‐formaldehyde mixtures

Abstract

The rate of copper dissolution in presence of phosphoric acid‐formaldehyde mixtures were studied by measuring the limiting current which represents the rate of electropolishing. It is found that the rate of dissolution is decreased by increasing H₃PO₄ concentration, electrode height and mole fraction of formaldehyde. It is found that the decrease in the rate of dissolution ranges from 24 per cent to 63.88 per cent depends on the mole fraction of formaldehyde. The thermodynamic parameter ΔH* ΔG* ΔS* was calculated.

Citation

El‐Batouti, M. (1998), "Corrosion of copper plates in presence of phosphoric acid‐formaldehyde mixtures", Anti-Corrosion Methods and Materials, Vol. 45 No. 5, pp. 321-326. https://doi.org/10.1108/00035599810234623