TY  - JOUR
AB  - Purpose– The purpose of this paper is to investigate the electrodeposition of copper coatings directly onto AZ31 magnesium alloy, considered as a substrate of electroplating nickel. The additive, pH, complexing agent, current density, time, and temperature of electrolytic bath were studied to understand electrodepositing copper coating on AZ31 magnesium alloy.Design/methodology/approach– Electrodeposition of copper was carried out in an aqueous solution containing copper hydroxide, citrate, and fluorine ion, which avoids the replacement or corrosion of the magnesium alloy. The morphology, structure, and interface of the electrodeposited copper coating were investigated by a scanning electron microscope (SEM).Findings– The copper coating was dense, and there was good adhesion of the copper coating on the AZ31 magnesium alloy. This suggests that successful deposition of copper using an electroplating process could decrease the cost of coating AZ31 magnesium alloy.Practical implications– This paper will be helpful for the development of coating on magnesium alloy using electroplating processes.Originality/value– Copper hydroxide and citrate were the main compositions of the electrolyte, combined with sodium poly dipropyl (SP) and polyethylene glycol (PEG) as brightening agents and can be used to electrodeposit copper directly onto AZ31 magnesium alloy.
VL  - 60
IS  - 3
SN  - 0003-5599
DO  - 10.1108/00035591311315247
UR  - https://doi.org/10.1108/00035591311315247
AU  - Zhu Ping
AU  - You Wang Liang
AU  - Ren Qian Guang
AU  - Hua Cao Tie
AU  - Zhou Ming
PY  - 2013
Y1  - 2013/01/01
TI  - Copper coating electrodeposited directly onto AZ31 magnesium alloy
T2  - Anti-Corrosion Methods and Materials
PB  - Emerald Group Publishing Limited
SP  - 127
EP  - 133
Y2  - 2024/04/23
ER  -