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The selection of sensitive temperature measurement points is the premise of thermal error modeling and compensation. However, most of the sensitive temperature measurement point selection methods do not consider the influence of the variability of thermal sensitive points on thermal error modeling and compensation. This paper considers the variability of thermal sensitive points, and aims to propose a sensitive temperature measurement point selection method and thermal error modeling method that can reduce the influence of thermal sensitive point variability.

Taking the truss robot as the experimental object, the finite element method is used to construct the simulation model of the truss robot, and the temperature measurement point layout scheme is designed based on the simulation model to collect the temperature and thermal error data. After the clustering of the temperature measurement point data is completed, the improved attention mechanism is used to extract the temperature data of the key time steps of the temperature measurement points in each category for thermal error modeling.

By comparing with the thermal error modeling method of the conventional fixed sensitive temperature measurement points, it is proved that the method proposed in this paper is more flexible in the processing of sensitive temperature measurement points and more stable in prediction accuracy.

The Grey Attention-Long Short Term Memory (GA-LSTM) thermal error prediction model proposed in this paper can reduce the influence of the variability of thermal sensitive points on the accuracy of thermal error modeling in long-term processing, and improve the accuracy of thermal error prediction model, which has certain application value. It has guiding significance for thermal error compensation prediction.

The paper aims to reveal the relationship among energy efficiency, thermal comfort and thermal regulation of electrically heated footwear and to investigate influencing factors on the energy efficiency and thermal comfort.

A finite volume model was proposed to simulate the two-dimensional heat transfer in electrically heated footwear (EHF) under an extremely cold condition. The model domain consists of three-layer footwear materials, a heating pad, a sock material, an air gap and skin tissues. Model predictions were verified by experimental data from cold-contact exposure. Then the influencing factors on the energy efficiency and thermal comfort were investigated through parametric analysis.

The paper demonstrated that the skin temperature control (STC) mode provided superior thermal comfort compared to the heating pad temperature control (HPTC) mode. However, the energy efficiency for the HPTC mode with a heating temperature of 38 °C was 18% higher than the STC mode. The energy efficiency of EHF while reaching the state of thermal comfort was strongly determined by the arrangement and connection of heating elements, heating temperature, thickness and thermal conductivity of footwear materials.

The findings obtained in this paper can be used to engineer the EHF that provides optimal thermal comfort and energy efficiency in cold environments.

To determine the optimal dimensions for a stacked micro‐channel using the genetic algorithms (GAs) under different flow constraints.

GA is used as an optimization tool for optimizing the thermal resistance of a stacked micro‐channel under different flow constraints obtained by using the one dimensional (1D) and two dimensional (2D) finite element methods (FEM) and by thermal resistance network model as well (proposed by earlier researcher). The 2D FEM is used to study the effect of two dimensional heat conduction in the micro‐channel material. Some parametric studies are carried out to determine the resulting performance of the stacked micro‐channel. Different number of layers of the stacked micro‐channel is also investigated to study its effect on the minimum thermal resistance.

The results obtained from the 1D FEM analysis compare well with those obtained from the thermal resistance network model. However, the 2D FEM analysis results in lower thermal resistance and, therefore, the importance of considering the conduction in two dimensions in the micro‐channel is highlighted.

The analysis is valid for constant properties fluid and for steady‐state conditions. The top‐most surfaces as well as the side surfaces of the micro‐channel are considered adiabatic.

The method is very useful for practical design of micro‐channel heat‐sinks.

FEM analyses of stacked micro‐channel can be easily implemented in the optimization procedure for obtaining the dimensions of the stacked micro‐channel heat‐sinks for minimum thermal resistance.

The purpose of this paper is to measure the thermal and moisture resistance of the knitted upper fabrics with the foot model, which provided basis for designing and producing sports shoes with thermal-moisture comfort.

In this paper, different yarn materials and fabric stitches were selected as the changing factors. The three kinds of yarn materials and the three kinds of fabric stitches were combined to design and weave eight pieces of knitted upper fabrics. Human sweating was simulated by the thermal-moisture comfort foot model, and then tested the thermal and moisture resistance of eight pieces of fabrics in different parts of the foot. Finally, the relationship between yarn material, fabric stitch, and the thermal and moisture resistance in different parts of the foot was analyzed by data.

The composition of the yarn material and fabric stitch has certain effect on the thermal-moisture comfort in different sections of the foot. When the yarn material of the four parts of the lateral arch, medial arch, ankle and heel is composed of 31.1tex moisture wicking polyester/33.3tex spandex coated yarn, the yarn material of the instep and toes is composed of 31.1tex ordinary polyester/33.3tex spandex coated yarn, and all parts of fabric stitch choose single-sided loop transfer stitch, the knitted sports shoes have the best thermal-moisture comfort.

The study used the thermal-moisture comfort foot model to simulate the human body metabolism and sweating system. Through the quantitative analyze of the thermal and moisture resistance of knitted upper fabrics to provide basis for the producers to design and product knitted sports shoes with good thermal-moisture comfort.

The paper aims to focus on the semiconductor temperature prediction in the multichip modules by using a simplified 1D model, easy to implement in the electronic simulation tools.

Accurate prediction of temperature variation of power semiconductor devices in power electronic circuits is important for obtaining optimum designs and estimating reliability levels. Temperature estimation of power electronic devices has generally been performed using transient thermal equivalent circuits. This paper has studied the thermal behaviour of the power modules. The study leads to correcting the junction temperature values estimated from the transient thermal impedance of each component operating alone. The corrections depend on multidimensional thermal phenomena in the structure.

The classic analysis of thermal phenomena in the multichip structures, independently of powers’ dissipated magnitude and boundary conditions, is not correct. An advanced 1D thermal model based on the finite element method is proposed. It takes into account the effect of the heat‐spreading angle of the different devices in the module.

The paper focuses on mathematical model of the thermal behaviour in the power module. The study leads to a correction of the junction temperature values estimated from the transient thermal impedance of each component given by manufacturers. The proposed model gives a good trade‐off between accuracy, efficiency and simulation cost.

The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.

A four‐factor factorial design with three replications is selected in the experiment. The input variables are the peak temperature, the duration of time above solder liquidus temperature (TAL), solder alloy and thermal shock. The peak temperature has three levels, 12, 22 and 32°C above solder liquidus temperatures (or 230, 240 and 250°C for SAC305 and 195, 205, and 215°C for SnPb). The TAL has two levels, 30 and 90 s. The thermally shocked test vehicles are subjected to air‐to‐air thermal shock conditioning from −40 to 125°C with 30 min dwell times (or 1 h/cycle) for 500 cycles. Samples both from the initial time zero and after thermal shock are cross‐sectioned. The IMC thickness is measured using scanning electron microscopy. Statistical analyses are conducted to compare the difference in IMC thickness growth between SAC305 solder joints and SnPb solder joints, and the difference in IMC thickness growth between after thermal shock and after thermal aging.

The IMC thickness increases with higher reflow peak temperature and longer time above liquidus. The IMC layer of SAC305 soldered joints is statistically significantly thicker than that of SnPb soldered joints when reflowed at comparable peak temperatures above liquidus and the same time above liquidus. Thermal conditioning leads to a smoother and thicker IMC layer. Thermal shock contributes to IMC growth merely through high‐temperature conditioning. The IMC thickness increases in SAC305 soldered joints after thermal shock or thermal aging are generally in agreement with prediction models such as that proposed by Hwang.

It is still unknown which thickness of IMC layer could result in damage to the solder.

The IMC thickness of all samples is below 3 μm for both SnPb and SAC305 solder joints reflowed at the peak temperature ranging from 12 to 32°C above liquidus temperature and at times above liquidus ranging from 30 to 90 s. The IMC thickness is below 4 μm after subjecting to air‐to‐air thermal shock from −40 to 125°C with 30 min dwell time for 500 cycles or thermal aging at 125°C for 250 h.

The paper reports experimental results of IMC thickness at different thermal conditions. The application is useful for understanding the thickness growth of the IMC layer at various thermal conditions.

This paper aims to develop thermal analysis method of thermal joints characterization. The impact on convection on thermal resistance analysis with use thermography for silver-based thermal joints were investigated for non-metallized and metalized semiconductor surfaces. Heat transfer efficiency depends on thermal conductivity; radiation was used to perform thermographic analysis; the convection is energy loss, so its removing might improve measurements accuracy.

Investigation of thermal joints analysis method was focused on determination of convection impact on thermal resistance thermographic analysis method. Measuring samples placed in vacuum chamber with lowered pressure requires transparent window for infrared radiation that is used for thermographic analysis. Impact of infrared window and convection on temperature measurements and thermal resistance were referred.

The results showed that the silicon window allowed to perform thermal analysis through, and the convection was heat transfer mode which create 15% energy loss.

It is possible to measure thermal resistance for silver-based thermal joints with convection eliminated to improve measurements accuracy.

Fabric structural parameters play an important role on the thermal comfort of clothing. The purpose of this paper is to investigate the effect of weave pattern and also the length of warp float in each weave pattern on the thermal properties of woven fabrics.

Cotton woven fabrics with 23 different weave patterns were produced with identical linear densities of warp and weft yarns as well as constant warp and weft nominal densities. Thereafter, their thermal properties were studied.

Statistical analysis demonstrated that the weave pattern significantly influences on the thermal properties of woven fabrics. Plain fabric exhibited the lowest thermal resistance and the highest thermal conductivity, and hopsack 2/2(4) weave fabric demonstrated the highest thermal resistance and the lowest thermal conductivity. Moreover, except hopsack (4) weave fabric, in all weave patterns, the length of warp float had a significant effect on the thermal characteristics of the fabrics, as increasing the warp float led to increase in the thermal resistance of the fabrics.

Weave pattern as one of the structural parameters of the fabric has a determinant role on the thermal properties of fabric and subsequently, the comfort of clothing produced from it. Owing to the lack of investigation in this area, this research considers the effect of weave pattern and the length of warp float in each weave pattern on the thermal properties of woven fabrics.

The purpose of this paper is to describe how a traditional metal base plate is replaced with a vapour chamber, a two‐phase flow heat transfer module with high heat transfer efficiency, to effectively reduce the temperature of heat sources as graphic processing unit (GPU) of smaller area and higher power.

As a first step, the nature of flow field of a vapour chamber‐based thermal module with heat sink is simulated and analysed through computational numerical method. Second, a sample is prepared according to the theoretical results and the performance of thermal modules is tested together with thermal performance experiment.

The results show that when the fin height from vapour chamber top to fan bottom area is more than 3 mm and not more than 8 mm, the vapour chamber‐based thermal module can achieve the optimum heat dissipation and the maximum heat flux may exceed 90 W/cm². Also, when copper fins are 3 mm in height, 0.2 mm in thickness, 53 in number and spaced out 1.0 mm apart, the optimum total thermal resistance of a vapour chamber‐based thermal module is 0.28 ^○C/W.

The Sapphire Atomic HD3870 of Video Graphics Array module for AMD RV670XT using MicroLoops vapour chamber has greater thermal performance than the AMD reference dual slot thermal module. So, AMD latest GPU is considered to be the vapour chamber thermal cooler to solve the higher power consumption.

The complexity of microelectronic circuits, their scale of integration and clock speed requirements have been increasing steadily. All these changes have the effect of increasing the power density of the microcircuits. ICs with a power of several watts and an area of over a square centimetre are quite common. Thus, there is more heat generated per device at die, component and substrate‐attach levels of electronic packaging. In order to maintain reliability of finished products, the junction temperature of the constituent devices must be kept low. It has been demonstrated that thermal management can be one key to lowering the cost and increasing the performance life of microelectronic products. The cost‐effectiveness of lowering device temperature has been demonstrated to be dramatic compared with the cost of thermal management materials. Proper thermal management of advanced microelectronic devices has to be addressed at all levels. One should address the problem from the basic level of die‐attach, through component‐attach, and eventually substrate‐attach to thermal drains. Thermal management is almost invariably coupled with a thermally induced stress problem. The increase in temperature at the device level also means a larger fluctuation of temperature from the ambient. Each cycle of on‐off for the device represents one thermal cycle. Stress‐induced failure due to coefficient of thermal expansion (CTE) mismatch is much more acute for higher power devices. In this paper, the authors address the issue of thermally induced stress on the microelectronic product at all levels of packaging, with major emphasis on component and substrate levels. Various ways and examples of reducing or eliminating this stress, which is a major cause of device failures, will be demonstrated. One of the proven methods is through the use of low Tg epoxies with high thermal stability.